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Kouji Shimomura
Kouji Shimomura
Chemistry
Physics
Reactive-ion etching
Analytical chemistry
Etching
5
Papers
24
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Dispositif de traitement et procede d'entretien dudit dispositif
2003
Daisuke Toriya
Kenji Homma
Akihiko Tsukada
Kouji Shimomura
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Ethanol‐Addition‐Enhanced, Chemical Vapor Deposited Tantalum Oxide Films from Ta ( OC 2 H 5 ) 5 and Oxygen Precursors
1998
Journal of The Electrochemical Society
Hiroshi Shinriki
Masahito Sugiura
Yijun Liu
Kouji Shimomura
Tsuyoshi Nakajima
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Citations (10)
Development and Performance Examination of a Two-Stage Detonation Light Gas Gun.
1996
Transactions of the Japan Society of Mechanical Engineers. B
Xinyu Chang
Kouji Shimomura
Shiro Taki
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Resist and Sidewall Film Removal after Al Reactive Ion Etching (RIE) Employing F+H2O Downstream Ashing
1993
Japanese Journal of Applied Physics
Sadayuki Jimbo
Kouji Shimomura
Tokuhisa Ohiwa
Makoto Sekine
Haruki Mori
Keiji Horioka
Haruo Okano
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Citations (9)
Influence of Al Surface Modification on Selectivity in Via-Hole Etching Employing CHF3 Plasma
1992
Japanese Journal of Applied Physics
Tokuhisa Ohiwa
Tsunetoshi Arikado
Keiji Horioka
Isahiro Hasegawa
Takaya Matsushita
Kouji Shimomura
Haruo Okano
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Citations (4)
1