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B. Goubault
B. Goubault
Electronic engineering
Materials science
Capacitor
Die (manufacturing)
Electrical engineering
3
Papers
11
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3D Printing as a New Packaging Approach for MEMS and Electronic Devices
2017
ECTC | Electronic Components and Technology Conference
G. Aspar
B. Goubault
O. Lebaigue
J.C. Souriau
G. Simon
L. Di Cioccio
Y. Brechet
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Stacking of 3D Capacitor Chips in a Package for a Compact and Reliable Component Working at High Temperature
2016
Stephan Borel
P. Descours
B. Goubault
P. Nicolas
R. Franiatte
G. Parat
M. Pommier
S. Yon
Gilles Simon
C. Bunel
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Stacking of 3D capacitor dies in a QFN package for a compact and reliable component for medical applications
2015
EPTC | Electronics Packaging Technology Conference
S. Borel
P. Descours
B. Goubault
M. Pommier
N. David
R. Franiatte
S. Yon
G. Parat
G. Simon
C. Bunel
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