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Sathana Kitayaporn

IBM

5

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Impurity in the Electroplated Sub-50nm Cu Lines

2014
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The Development of a Chemistry and Process for Cu Damascene Plating – from Research to Development to Manufacturing

2014
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Impurities in the Electroplated sub-50 nm Cu Lines: The Effects of the Plating Additives

2014 Journal of The Electrochemical Society
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Impurity-Induced Tin Incorporation During Copper Electrodeposition

2013
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