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Jiah Hong
Jiah Hong
Sungkyunkwan University
X-ray photoelectron spectroscopy
Materials science
Chemical engineering
Chemical-mechanical planarization
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2
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1
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Improvement of oxide removal rate in chemical mechanical polishing by forming oxygen vacancy in ceria abrasives via ultraviolet irradiation
2021
Materials Chemistry and Physics
Eungchul Kim
Jiah Hong
Seok-Jun Hong
Chaitanya Kanade
Hyunho Seok
Hyeong-U Kim
Taesung Kim
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Investigation of abrasive-free slurry for polysilicon buffing chemical mechanical planarization
2021
Materials Science in Semiconductor Processing
Sanghuck Jeon
Jiah Hong
Seok-Jun Hong
Chaitanya Kanade
Kihong Park
Hyunho Seok
Hojoong Kim
Sunyoung Lee
Taesung Kim
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