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Shigeaki Sakatani
Shigeaki Sakatani
Osaka University
Materials science
Metallurgy
Soldering
Intermetallic
Composite material
6
Papers
52
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Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases
2005
Materials Transactions
Takashi Yamamoto
Shigeaki Sakatani
Shinji Kobayashi
Keisuke Uenishi
Kojiro F. Kobayashi
Masaaki Ishio
Kazuhiro Shiomi
Akio Hashimoto
Masaharu Yamamoto
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Citations (17)
Solderability of BGA Joints between Cu Core Solder Balls with Sn/Ag Multi Plating and Ni/Au Coated Pads
2003
Journal of Japan Institute of Electronics Packaging
Shigeaki Sakatani
Toshio Saeki
Yasuhiro Kohara
Keisuke Uenishi
Kojiro F. Kobayashi
Masaharu Yamamoto
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Citations (6)
Melting and joining behavior of Sn/Ag and Sn-Ag/Sn-Bi plating on Cu core ball : Lead-free electronics packaging
2002
Materials Transactions Jim
Keisuke Uenishi
Yasuhiro Kohara
Shigeaki Sakatani
Toshio Saeki
Kojiro F. Kobayashi
Masaharu Yamamoto
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Melting and Joining Behavior of Sn/Ag and Sn-Ag/Sn-Bi Plating on Cu Core Ball
2002
Materials Transactions
Keisuke Uenishi
Yasuhiro Kohara
Shigeaki Sakatani
Toshio Saeki
Kojiro F. Kobayashi
Masaharu Yamamoto
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Citations (26)
Lead-Free Electronics Packaging. Melting and Joining Behavior of Sn/Ag and Sn-Ag/Sn-Bi Plating on Cu Core Ball.
2002
Materials Transactions
Keisuke Uenishi
Yasuhiro Kohara
Shigeaki Sakatani
Toshio Saeki
Kojiro F. Kobayashi
Masaharu Yamamoto
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Citations (3)
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