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Kok Fah Choo

Nanyang Technological University

17

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302

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Multi-nozzle array spray cooling for large area high power devices in a closed loop system

2014 International Journal of Heat and Mass Transfer
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Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

2014 IEEE Transactions on Components, Packaging and Manufacturing Technology
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Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device

2014 IEEE Transactions on Components, Packaging and Manufacturing Technology
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Thermal management of hotspots using upstream laminar micro-jet impinging array

2013 EPTC | Electronics Packaging Technology Conference
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Accurate thermal characterization of a GaN PA MMIC using Thermoreflectance thermography

2013 ICEPT | International Conference on Electronic Packaging Technology
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Development of package level hybrid silicon heat sink for hotspots cooling

2013 EPTC | Electronics Packaging Technology Conference
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Thermal analysis of high-powered devices using analytical and experimental methods

2012 ICEPT | International Conference on Electronic Packaging Technology
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Thermal characterization and modelling of a gallium arsenide power amplifier MMIC

2012 ITherm | Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
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GaN-on-Si hotspot thermal management using direct-die-attached microchannel heat sink

2012 EPTC | Electronics Packaging Technology Conference
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Measurement of MMIC gate temperature using infrared and Thermoreflectance thermography

2012 EPTC | Electronics Packaging Technology Conference
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