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Tingdong Zhou

IBM

14

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36

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The IEEE EPS Packaging Benchmark Suite

2021 EPEP | Electrical Performance of Electronic Packaging
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Deriving voltage tolerance specification for processor circuit design

2011 EPEP | Electrical Performance of Electronic Packaging
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Packaging design challenges of the IBM system z10 enterprise class server

2009 Ibm Journal of Research and Development
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Methodology for minimizing far-end noise coupling between interconnects in high-speed ceramic modules

2009 ECTC | Electronic Components and Technology Conference
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Improving single-ended channel performance with a dynamic reference voltage scheme

2009 EPEP | Electrical Performance of Electronic Packaging
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Network flow based BSM asssignment

2009 ICICDT | International Conference on IC Design and Technology
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Minimizing crosstalk noise in vias or pins by optimizing signal assignment in a high-speed differential bus

2008 EPEP | Electrical Performance of Electronic Packaging
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High-speed interconnect and packaging design of the IBM System z9 processor cage

2007 Ibm Journal of Research and Development
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On chip circuit model for accurate mid-frequency simultaneous switching noise prediction

2005 EPEP | Electrical Performance of Electronic Packaging
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High-end server system partitioning for cost reduction

2004 EPEP | Electrical Performance of Electronic Packaging
- George A. Katopis
- Tingdong Zhou
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