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Takaaki Noudou

Hitachi

6

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27

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Cu Paste for Molded Interconnect Devices

2018
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A Study of Solder Ball Joint Reliability of Electroless Ni/Pd/Au Plating － Influence of Electroless Pd Plating Film Thickness－

2016
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Material Technology of Conductive Wiring for Ink-jet Print

2011 Transactions of The Japan Institute of Electronics Packaging
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