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J.R. Morris
J.R. Morris
Alcatel-Lucent
Electronic engineering
Flip chip
Materials science
Chip
Failure mode and effects analysis
4
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7
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Designed experiment to assess the surface mount attachment reliability of 14 mil pitch (1000 I/O) underfilled DCA
2000
IEMT | International Electronics Manufacturing Technology Symposium
S. Yegnasubramanian
R. Deshmukh
H.D. Rubin
R. Fanucci
J. Gannon
A. Serafino
B. Slabinski
M. Occhipinti
J.R. Morris
D.M. Noctor
R.K. Wolf
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Flip-chip-on-board (FCOB) assembly and reliability
1997
IEMT | International Electronics Manufacturing Technology Symposium
S. Yegnasubramanian
R. Deshmukh
J. Fulton
R. Fanucci
J. Gannon
J.R. Morris
K. Nikmanesh
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Citations (5)
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