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Gary Long
Gary Long
Intel
Printed circuit board
Materials science
Engineering
Soldering
Electronic engineering
7
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15
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Thermal cycling reliability, microstructural characterization, and assembly challenges with backward compatible soldering of a large, high density ball grid array
2011
ECTC | Electronic Components and Technology Conference
Vasu Vasudevan
Richard J. Coyle
Raiyo Aspandiar
Steve Tisdale
Robert Kinyanjui
Gary Long
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Citations (3)
Thermal Cycling Reliability, Microstructural Characterization, and Assembly Challenges with Backward Compatible Soldering of a Large, High Density Ball Grid Array
2011
Electronic Components and Technology Conference
Vasu Vasudevan
Richard J. Coyle
Raiyo Aspandiar
Stephen Tisdale
Robert Kinyanjui
Gary Long
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Citations (2)
Advanced Print Circuit Board Materials
2009
Gary A. Brist
Gary Long
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Application of shadow moire technique to board level manufacturing technologies
2006
ECTC | Electronic Components and Technology Conference
Phil Geng
Tozer Bandorawalla
Steve Cho
Hank Hsiao
Jonathon Kuchy
Gary Long
Robert R. Martinson
Alan McAllister
Michael Mello
Karumbu Meyyappan
Richard L. Williams
Liping Zhu
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Devices, systems and methods for power supply
2004
William O. Alger
Gary A. Brist
Gary Long
Carlos Mejia
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