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C. Asanasavest
C. Asanasavest
Materials science
Electronic engineering
Composite material
Development environment
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Wire sweep control with mold compound formulations [plastic packaging]
1997
ECTC | Electronic Components and Technology Conference
L. Nguyen
J. Jackson
C.H. Teo
S. Chillara
C. Asanasavest
T. Burke
R. Walberg
R Lo
P. Weiler
D Ho
H. Rauhut
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