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Cheng-Chen Lin
Cheng-Chen Lin
Chang Gung University
Light-emitting diode
Electronic engineering
Flip chip
Thermal conductivity
Engineering
4
Papers
56
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Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts
2012
Microelectronics Reliability
Ming-Jer Jeng
Kuo-Ling Chiang
Hsin-Yi Chang
Chia-Yi Yen
Cheng-Chen Lin
Yuan-Hsiao Chang
Mu-Jen Lai
Yu-Lin Lee
Liann-Be Chang
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Citations (19)
Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps
2010
Microelectronics Reliability
Cheng-Chen Lin
Liann-Be Chang
Ming-Jer Jeng
Chia-Yi Yen
Atanu Das
C. Y. Tang
M. Y. Tsai
Mu-Jen Lai
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Citations (19)
Thermal measurements and analysis of flip-chip LED packages with and without underfills
2010
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
C. Y. Tang
M. Y. Tsai
Cheng-Chen Lin
Liann-Be Chang
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Citations (7)
Electrostatic Reliability Characteristics of GaN Flip-Chip Power Light-Emitting Diodes With Metal–Oxide–Silicon Submount
2010
IEEE Transactions on Electron Devices
Liann-Be Chang
Kuo-Ling Chiang
Hsin-Yi Chang
Ming-Jer Jeng
Chia-Yi Yen
Cheng-Chen Lin
Yuan-Hsiao Chang
Mu-Jen Lai
Yu-Lin Lee
Tai-Wei Soong
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Citations (11)
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