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Guy Clark

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A CHUNK OF WOOD

2017
- Guy Clark
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2-die wafer-level chip scale packaging enables the smallest TCXO for mobile and wearable applications

2015 ECTC | Electronic Components and Technology Conference
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Common Pitfalls and Issues during Generic Licensing Negotiations

2007 Journal of Generic Medicines
- Guy Clark
- Richard L. DiCicco
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Amorphous metalletikettiersystem for under ground-structures

1995
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