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Tomoko Jimbo

Hitachi

6

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39

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A Flexible 0.18 $\mu{\rm m}$ BiCMOS Technology Suitable for Various Applications

2013 IEEE Journal of the Electron Devices Society
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Influence of CMP Slurries and Post-CMP Cleaning Solutions on Cu Interconnects and TDDB Reliability

2008 Journal of The Electrochemical Society
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Influence of Cu-CMP Process on Defects in SiOC Films and TDDB Reliability

2006 IEICE technical report. Speech
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Density of states of Cu with stacking faults

2003 Advances in Quantum Chemistry
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Thermal desorption behaviour of adsorbed materials on wafer surfaces

1997 ISSM | International Symposium on Semiconductor Manufacturing
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