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John Boyle
John Boyle
Applied Materials
Lithography
Wafer
Engineering
Reliability engineering
Engineering drawing
5
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19
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EUV mask cleans comparison of frontside and dual-sided concurrent cleaning
2015
Proceedings of SPIE
Lin Lee Cheong
Louis Kindt
Christina Turley
Dusty Leonhard
John Boyle
Christopher F. Robinson
Jed H. Rankin
Daniel Corliss
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Citations (4)
Lithography process control and optimization based on defect capture and reduction
2000
Jeffrey A. Leavey
John Boyle
Andrew Skumanich
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Advanced process control based on lithographic defect inspection and reduction
2000
ASMC | Advanced Semiconductor Manufacturing Conference
Jeffrey A. Leavey
John Boyle
Andrew Skumanich
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Advanced interconnect process development utilizing wafer inspection with "on-the-fly" automatic defect classification
1999
ASMC | Advanced Semiconductor Manufacturing Conference
Andy Skumanich
John Boyle
Darius Brown
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Citations (7)
Optimization of advanced design rule processes utilizing postdevelop patterned-wafer inspection
1999
Andrew Skumanich
John Boyle
Gary Snyder
Xiaoming Yin
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