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Alexander Kabansky
Alexander Kabansky
Lam Research
Copper interconnect
Tin
Materials science
Metallurgy
hard mask
3
Papers
38
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Predicting synergy in atomic layer etching
2017
Journal of Vacuum Science and Technology
Keren Jacobs Kanarik
Samantha Tan
Wenbing Yang
Taeseung Kim
Thorsten Lill
Alexander Kabansky
Eric Hudson
Tomihito Ohba
Kazuo Nojiri
Jengyi Yu
Rich Wise
Ivan L. Berry
Yang Pan
Jeffrey Marks
Richard A. Gottscho
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Citations (33)
Optimization of Cu/Low-k Dual Damascene Post-Etch Residue and TiN Hard Mask Removal
2016
Solid State Phenomena
Alexander Kabansky
Glenn Westwood
Samantha Tan
Frederic Kovacs
David Lou
Joe Han
Gerardo Delgadino
H.W. Chang
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Effective Defect Control in TiN Metal Hard Mask Cu/Low-k Dual Damascene Process
2013
Alexander Kabansky
Samantha Tan
Eric Hudson
Gerardo Delgadino
Lajos Gancs
Jeffrey Marks
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Citations (5)
1