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He Zengxu
He Zengxu
stress induced
copper substrate
Materials science
Deformation (mechanics)
Lapping
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A Research on Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping
2021
Jiang Guo
He Zengxu
Bin Wang
Bo Pan
Qian Bai
Jinxing Kong
Renke Kang
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