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Mayur Sabale
Mayur Sabale
Electronic engineering
Miniaturization
Engineering
Flip chip
Drop impact
2
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Effect of underfill design parameters on die cracking in flip chip on flexible substrates
2014
ITherm | Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Mayur Sabale
Kiran Vinerkar
Shiwani Thakur
Sandeep Tonapi
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