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S. Tollabimazraehno
S. Tollabimazraehno
Johannes Kepler University of Linz
Wafer bonding
Auger electron spectroscopy
Materials science
Thermocompression bonding
Anodic bonding
4
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106
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Analytical methods used for low temperature Cu---Cu wafer bonding process evaluation
2015
Microsystem Technologies-micro-and Nanosystems-information Storage and Processing Systems
Bernhard Rebhan
S. Tollabimazraehno
G. Hesser
V. Dragoi
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Citations (6)
Cu-Cu wafer bonding: An enabling technology for three-dimensional integration
2014
ICEP | International Conference on Electronics Packaging
Bernhard Rebhan
Thomas Plach
S. Tollabimazraehno
Viorel Dragoi
M. Kawano
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Citations (7)
Mechanisms for room temperature direct wafer bonding
2013
Journal of Applied Physics
T. Plach
Kurt Hingerl
S. Tollabimazraehno
G. Hesser
V. Dragoi
Markus Wimplinger
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Citations (93)
Copper-oxide reduction for low-temperature wafer bonding
2012
Bernhard Rebhan
S. Tollabimazraehno
T. Plach
G. Hesser
Jürgen Burggraf
Gerald Mittendorfer
V. Dragoi
Markus Wimplinger
Kurt Hingerl
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