Old Web
English
Sign In
Acemap
>
authorDetail
>
Jay J. Liu
Jay J. Liu
Electronic engineering
Ceramic
Soldering
Ball grid array
Image warping
2
Papers
29
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Effects of Ceramic Ball-Grid-Array Package’s Manufacturing Variations on Solder Joint Reliability
1994
Journal of Electronic Packaging
Teh-Hua Ju
Wei Lin
Yung-Cheng Lee
Jay J. Liu
Show All
Source
Cite
Save
Citations (16)
1