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Y. W. Lee
Y. W. Lee
TSMC
Physics
Electronic engineering
Time-dependent gate oxide breakdown
Thermal
Spice
3
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13
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0
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Integrated Deep Trench Capacitor in Si Interposer for CoWoS Heterogeneous Integration
2019
IEDM | International Electron Devices Meeting
Shang-Yun Hou
Chung-Cheng Wu
Douglas Yu
H. Hsia
C.H. Tsai
K. C. Ting
T-H Yu
Y. W. Lee
Fang-Cheng Chen
W.C. Chiou
C. T. Wang
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Citations (10)
An Unique Methodology to Estimate The Thermal Time Constant and Dynamic Self Heating Impact for Accurate Reliability Evaluation in Advanced FinFET Technologies
2018
IEDM | International Electron Devices Meeting
S. Mukhopadhyay
A. Kundu
Y. W. Lee
H. D. Hsieh
D. S. Huang
J.J. Horng
T.H. Chen
Jian-Hsing Lee
Y. S. Tsai
Chung-Kai Lin
Ryan Lu
Jun He
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Citations (1)
New TDDB lifetime model for AC inverter-like stress in advance FinFET structure
2015
IRPS | International Reliability Physics Symposium
I. K. Chen
Chia-Lin Chen
Y.-H. Lee
Ryan Lu
Y. W. Lee
H. H. Hsu
Y.W. Tseng
Y. W. Lin
J.R. Shih
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Citations (2)
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