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Chenghui Yang
Chenghui Yang
Hebei University of Technology
Chemical-mechanical planarization
Copper
Materials science
X-ray photoelectron spectroscopy
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5
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8
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Prediction of planarization property in copper film chemical mechanical polishing via response surface methodology and convolutional neural network
2021
Jiakai Zhou
Xinhuan Niu
Tianlin Zhang
He Wang
Chenghui Yang
Yinchan Zhang
Wantang Wang
Zhi Wang
Yebo Zhu
Ziyang Hou
Ru Wang
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Effect of Potassium Oleate as Inhibitor on Copper Chemical Mechanical Polishing
2020
CSTIC | China Semiconductor Technology International Conference
Chenghui Yang
Xinhuan Niu
Jiakai Zhou
Zhaoqing Huo
Yanan Lu
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Roles and mechanism analysis of chitosan as a green additive in low-tech node copper film chemical mechanical polishing
2020
Colloids and Surfaces A: Physicochemical and Engineering Aspects
Jiakai Zhou
Xinhuan Niu
Zhi Wang
Yaqi Cui
Jianchao Wang
Chenghui Yang
Zhaoqing Huo
Ru Wang
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Surface action mechanism and planarization effect of sarcosine as an auxiliary complexing agent in copper film chemical mechanical polishing
2020
Applied Surface Science
Jiakai Zhou
Xinhuan Niu
Chenghui Yang
Zhaoqing Huo
Yanan Lu
Zhi Wang
Yaqi Cui
Ru Wang
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Citations (3)
Effect of Potassium Salts on the Chemical Mechanical Polishing Efficiency of Sapphire Substrate
2020
CSTIC | China Semiconductor Technology International Conference
Yanan Lu
Xinhuan Niu
Yaqi Cui
Xin Zhao
Zhaoqing Huo
Chenghui Yang
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