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S. Savastionk
S. Savastionk
Chip-scale package
Software deployment
Wafer-level packaging
Die preparation
Manufacturing engineering
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Thru-silicon vias for 3D WLP
2000
APMPPI | International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces
S. Savastionk
O. Siniaguine
E. Korczynski
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