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Tsan-Feng Lu
Tsan-Feng Lu
Materials science
Composite material
Kinetics
Wafer bonding
Electrical conductor
4
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5
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Effect of Compressive Stress on Evolution and Healing Kinetics of Artificial Voids in Highly (111)-Oriented Cu-Cu Wafer Bonding at 300°C
2021
ECS Journal of Solid State Science and Technology
YewChung Sermon Wu
Meiyi Li
Tung-Yen Lai
Tsan-Feng Lu
Yu-Hsiang Wang
Jiun-Wei Chang
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Evolution Kinetics of Voids in Electroplated Cu-Cu Wafer Bonding
2021
ECS Journal of Solid State Science and Technology
Tung-Yen Lai
Meiyi Li
Tzu-Yen Tseng
Tzu-Chen Lin
Tsan-Feng Lu
YewChung Sermon Wu
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Bonding Mechanisms of Roughened Nanotwinned-Cu Surface at Temperature as Low as 120°C
2020
ECS Journal of Solid State Science and Technology
YewChung Sermon Wu
Tung-Yen Lai
Meiyi Li
Tsan-Feng Lu
Yu-Hsiang Wang
Tzu-Yen Tseng
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Transparent Flexible Electrode with Conductive Coating Induced by Proton Implantation of Emeraldine Polyaniline Covalently Functionalized on Polydimethylsiloxane
2019
Pen-Cheng Wang
Tsan-Feng Lu
Tzu-Hsiang Lin
Ching-Jung Lo
Ping-Ching Pai
Chen-Kan Tseng
Hui-Yu Tsai
Ming-Wei Lin
Tsung Min Hung
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