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Pieter Bex
Pieter Bex
IMEC
Materials science
Wafer
Interconnection
Electronic engineering
Optoelectronics
5
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16
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A High-Bandwidth Fine-Pitch 2.57Tbps/mm In-package Communication Link Achieving 48fJ/bit/mm Efficiency
2019
ECTC | Electronic Components and Technology Conference
Nicolas Pantano
Geert Van der Plas
Pieter Bex
Philip Nolmans
Dimitrios Velenis
Marian Verhelst
Eric Beyne
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Citations (1)
Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up
2019
ECTC | Electronic Components and Technology Conference
Arnita Podpod
Alain Phommahaxay
Pieter Bex
John Slabbekoorn
Julien Bertheau
Abdellah Salahoueldhadj
Erik Sleeckx
Andy Miller
Gerald Beyer
Eric Beyne
Alice Guerrero
Kim Yess
Kim Arnold
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Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems
2019
ECTC | Electronic Components and Technology Conference
Alain Phommahaxay
Samuel Suhard
Pieter Bex
Serena Iacovo
John Slabbekoorn
Fumihiro Inoue
Lan Peng
Koen Kennes
Erik Sleeckx
Gerald Beyer
Eric Beyne
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Citations (6)
High density and high-bandwidth chip-to-chip connections with 20μm pitch flip-flop chip on fan-out wafer level package
2018
Arnita Podpod
Dimitrios Velenis
Alain Phommahaxay
Pieter Bex
Ferenc Fodor
Erik Jan Marinissen
Kenneth June Rebibis
Andy Miller
Gerald Beyer
Eric Beyne
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Die to wafer 3D stacking for below 10um pitch microbumps
2016
DIC | IEEE International D Systems Integration Conference
Jaber Derakhshandeh
Lin Hou
Inge De Preter
C. Gerets
Samuel Suhard
Vikas Dubey
Geraldine Jamieson
Fumihiro Inoue
Tomas Webers
Pieter Bex
Giovanni Capuz
Eric Beyne
John Slabbekoorn
Teng Wang
Anne Jourdain
Gerald Beyer
Kenneth June Rebibis
Andy Miller
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Citations (5)
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