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Shinichi Oizumi
Shinichi Oizumi
Nitto Denko
Electronic engineering
Composite material
Materials science
Semiconductor device
Soldering
2
Papers
10
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マイクロカプセル型硬化剤、マイクロカプセル型硬化促進剤およびそれらの製法、ならびにエポキシ樹脂組成物、半導体封止用エポキシ樹脂組成物
1998
Tadaaki Harada
Toshitsugu Hosokawa
Kazuhiro Ikemura
Sadahito Misumi
Tsutomu Nishioka
Shinichi Oizumi
Takashi Taniguchi
Minoru Yamane
sadahito misumi
tadaaki harada
sin'iti ooizumi
mi yamane
kazuhiro ikemura
tositugu hosokawa
tutomu nisioka
takesi taniguti
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Molding compounds for thin surface mount packages and large chip semiconductor devices
1991
ECTC | Electronic Components and Technology Conference
S. Ito
Tsutomu Nishioka
Shinichi Oizumi
Kazuhiro Ikemura
K. Igarashi
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Citations (10)
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