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Carlo Passagrilli

STMicroelectronics

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A Complete Explanation of Warpage Behavior Across Backend Processes on Organic BGA in Strip Form and its Predictive Methodology

2018 EPTC | Electronics Packaging Technology Conference
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Dynamic Warpage Analysis of QFP Packages During Soldering Reflow Process and Thermal Cycle

2018 ECTC | Electronic Components and Technology Conference
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