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Kang J. Lee
Kang J. Lee
Intel
Capacitor
Electronic engineering
Resistor
Materials science
Microvia
5
Papers
15
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Printed circuit board (PCB) miniaturization by embedded passives and sequential build-up (SBU)process methodology
2013
Journal of the Indian Institute of Science
Mahesh Varadarajan
Kang J. Lee
Swapan K. Bhattacharya
Raghuram V. Pucha
Rao Tummala
Suresh K. Sitaraman
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Citations (1)
Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates
2007
IEEE Transactions on Components and Packaging Technologies
Kang J. Lee
Manoj Damani
Raghuram V. Pucha
Swapan K. Bhattacharya
Rao Tummala
Suresh K. Sitaraman
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Citations (6)
Design, Fabrication and Reliability Assessment of Embedded Resistors and Capacitors in a Multilayered Organic Substrate with Microvias
2006
Swapan K. Bhattacharya
Raghuram V. Pucha
Rao Tummala
Suresh K. Sitaraman
Mahesh Varadarajan
Kang J. Lee
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Studies on design, fabrication and reliability assessment of embedded passives on a high-density interconnect (HDI) organic substrate using a sequential build-up process
2006
Mahesh Varadarajan
Kang J. Lee
Swapan K. Bhattacharya
Ajanta Bhattacharjee
Lixi Wan
Raghuram V. Pucha
Rao Tummala
Suresh K. Sitaraman
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Citations (4)
Measurement, Modeling and Characterization of Embedded Capacitors for Power Delivery in the Mid-Frequency Range
2005
Prathap Muthana
Ege Engin
Madhavan Swaminathan
Rao Tummala
Venkatesh Sundaram
Lixi Wan
Soumendu Bhattacharya
Pulugurtha Markondeya Raj
Kang J. Lee
Mahesh Varadarajan
I.R. Abothu
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Citations (4)
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