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Ya-Sheng Tang
Ya-Sheng Tang
National Chiao Tung University
Metallurgy
Engineering
Semiconductor
Eutectic bonding
Intermetallic
4
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86
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Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic Bonding
2018
IEEE Transactions on Components, Packaging and Manufacturing Technology
Ya-Sheng Tang
Hsiu-Chi Chen
Yi-Tung Kho
Yu-Sheng Hsieh
Yao-Jen Chang
Kuan-Neng Chen
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Development and investigation of ultra-thin buffer layers used in symmetric Cu/Sn bonding and asymmetric Cu/Sn-Cu bonding for advanced 3D integration applications
2017
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Hsiu-Chi Chen
Yi-Tung Kho
Yen-Jun Huang
Yu-Sheng Hsieh
Yao-Jen Chang
Ya-Sheng Tang
Ting-Yang Yu
Kuan-Neng Chen
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Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders Joints
2017
IEEE Transactions on Components, Packaging and Manufacturing Technology
Ya-Sheng Tang
Jaber Derakhshandeh
Yi-Tung Kho
Yao-Jen Chang
John Slabbekoorn
Inge De Preter
Kris Vanstreels
Kenneth June Rebibis
Eric Beyne
Kuan-Neng Chen
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Citations (2)
Wafer-level Cu-Cu bonding technology
2012
Microelectronics Reliability
Ya-Sheng Tang
Yao-Jen Chang
Kuan-Neng Chen
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Citations (80)
1