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Moon Soo Lee

Samsung

Computer science
Capillary action
Electronic engineering
Soldering
Flow visualization

2

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Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique

2021 IRPS | International Reliability Physics Symposium
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PCB Strip Scale Numerical Study on Vacuum Molded Underfill Void Entrapment in FC-POP Devices

2019 IIRW | International Integrated Reliability Workshop
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acemap@cs.sjtu.edu.cn

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