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O. Wünsch
O. Wünsch
Technical University of Berlin
Materials science
Electronic engineering
Wafer backgrinding
Die preparation
Wafer bonding
3
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TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
2011
Electronic Components and Technology Conference
Kai Zoschke
J. Wolf
Christina Lopper
Ingrid Kuna
N. Jürgensen
V. Glaw
K. Samulewicz
J. Röder
Martin Wilke
O. Wünsch
Marcus Oliver Klein
Maria von Suchodoletz
Hermann Oppermann
Thomas R. Braun
Robert Wieland
O. Ehrmann
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Citations (24)
TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
2011
ECTC | Electronic Components and Technology Conference
Kai Zoschke
Juergen Wolf
Christina Lopper
Ingrid Kuna
N. Jürgensen
V. Glaw
K. Samulewicz
J. Röder
Martin Wilke
O. Wünsch
Matthias Klein
Maria von Suchodoletz
Hermann Oppermann
T. Braun
Robert Wieland
O. Ehrmann
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Citations (49)
1