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Philippe Vereecken
Philippe Vereecken
University of Illinois at Urbana–Champaign
Mineralogy
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Sodium
2
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21
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Effect of Additives on Shape Evolution during Electrodeposition III. Trench Infill for On-Chip Interconnects
2008
Journal of The Electrochemical Society
Yan Qin
Xiaohai Li
Feng Xue
Philippe Vereecken
Panayotis C. Andricacos
Hariklia Deligianni
Richard D. Braatz
Richard C. Alkire
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Citations (21)
Recouvrement selectif de cablage de cuivre
2004
Panayotis C. Andricacos
Shyng-Tsong Chen
John M. Cotte
Hariklia Deligianni
Mahadevaiyer Krishnan
Wei-Tsu Tseng
Philippe Vereecken
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