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Oh Young Kwon
Oh Young Kwon
Seoul National University of Science and Technology
Composite material
Materials science
Thermal copper pillar bump
Flip chip
Analytical chemistry
3
Papers
2
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0
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The Effects of Grid Shape on Flexibility and Durability of Flexible Transparent Metal Grid Films
2018
Journal of the Korean Society for Precision Engineering
Oh Young Kwon
Yo Sep Lee
Won Jae Lee
Young Moon Jang
Sung Hoon Choa
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Reliable peripheral anchor-assisted transfer printing of ultrathin SiO2 for a transparent and flexible IGZO-based inverter
2018
Microelectronic Engineering
Jung Il Yoo
Hun Soo Jang
Juhwan Jang
Jongwon Yoon
Oh Young Kwon
Jong Jun Park
Sang Myeong Kang
Tae Jin Yoo
Seung Hyun Kim
Byoung Hun Lee
Sung Hoon Choa
Heung Cho Ko
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Stress Analysis of the Low-k Layer in a Flip-Chip Package with an Oblong Copper Pillar Bump
2017
Nanoscience and Nanotechnology Letters
Cha Gyu Song
Oh Young Kwon
Hoon Sun Jung
Eun Sook Sohn
Sung Hoon Choa
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