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J. Casutt
J. Casutt
Thales Group
Insulated-gate bipolar transistor
Engineering
Electronic engineering
Failure mode and effects analysis
Finite element method
6
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29
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Improvement of the Reliability of Connections Used in IGBT Modules, in Aeronautical Environment
2008
Adrien Zéanh
Olivier Dalverny
Moussa Karama
Eric Woirgard
Stephane Azzopardi
A. Bouzourene
J. Casutt
Michel Mermet-Guyennet
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Reliability of the connections used in IGBT modules, in aeronautical environment
2008
International Journal for Simulation and Multidisciplinary Design Optimization
Adrien Zéanh
Olivier Dalverny
Moussa Karama
Eric Woirgard
Stephane Azzopardi
A. Bouzourene
J. Casutt
Michel Mermet-Guyennet
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Citations (3)
Thermomechanical modelling and reliability study of an IGBT module for an aeronautical application
2008
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Adrien Zéanh
Olivier Dalverny
Moussa Karama
Eric Woirgard
Stephane Azzopardi
A. Bouzourene
J. Casutt
Michel Mermet-Guyennet
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Citations (21)
Reliability of the connections used in IGBT modules, in aeronautical environment
2007
Adrien Zéanh
Olivier Dalverny
Moussa Karama
Eric Woirgard
Stephane Azzopardi
A. Bouzourene
J. Casutt
Michel Mermet-Guyennet
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Reliability of the connections used in IGBT modules, in aeronautical environment
2007
Adrien Zéanh
Olivier Dalverny
Moussa Karama
Eric Woirgard
Stephane Azzopardi
A. Bouzourene
J. Casutt
Michel Mermet-Guyennet
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