Old Web
English
Sign In
Acemap
>
authorDetail
>
Takahiro Shimohata
Takahiro Shimohata
Computer hardware
Materials science
Wafer testing
Electronic engineering
Wafer
3
Papers
2
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device
2017
Ieej Transactions on Sensors and Micromachines
Noriyuki Fujimori
Takatoshi Igarashi
Takahiro Shimohata
Takuro Suyama
Kazuhiro Yoshida
Yusuke Nakagawa
Tsutomu Nakamura
Toshiro Sato
Show All
Source
Cite
Save
Citations (0)
Image pickup device and method of manufacturing the image pickup device
2015
Takahiro Shimohata
Takuro Suyama
Show All
Source
Cite
Save
Citations (0)
Wafer level package by using post dicing process
2014
ICEP | International Conference on Electronics Packaging
Noriyuki Fujimori
Takatoshi Igarashi
Takahiro Shimohata
Takuro Suyama
Kazuhiro Yoshida
Yusuke Nakagawa
Tsutomu Nakamura
Toshiro Sato
Show All
Source
Cite
Save
Citations (2)
1