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Yasuko Tachibana
Yasuko Tachibana
Toray Industries
Electronic engineering
Chip-scale package
Wafer-level packaging
Photolithography
Engineering
1
Papers
11
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Wafer and/or chip bonding adhesives for 3D package
2010
ICSJ | CPMT Symposium Japan
Toshihisa Nonaka
Koichi Fujimaru
Akira Shimada
Noboru Asahi
Yoshiko Tatsuta
Hiroyuki Niwa
Yasuko Tachibana
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Citations (11)
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