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Yuta Kobayashi
Yuta Kobayashi
Toray Industries
Soldering
Die (manufacturing)
Materials science
Composite material
Daisy chain
2
Papers
26
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Flip chip assembly with wafer level NCF
2014
ICEP | International Conference on Electronics Packaging
Yuta Kobayashi
Toshihisa Nonaka
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High throughput thermal compression NCF bonding
2014
ECTC | Electronic Components and Technology Conference
Toshihisa Nonaka
Yuta Kobayashi
Noboru Asahi
Shoichi Niizeki
Koichi Fujimaru
Yoshiyuki Arai
Toshifumi Takegami
Yoshinori Miyamoto
Masatsugu Nimura
Hiroyuki Niwa
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Citations (23)
1