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Dingyou Zhang
Dingyou Zhang
Electronic engineering
Materials science
Composite material
Delamination
Fracture mechanics
2
Papers
7
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Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages
2018
ECTC | Electronic Components and Technology Conference
Wei Wang
Dingyou Zhang
Yangyang Sun
David Fraser Rae
Lily Zhao
Jiantao Zheng
Mark Schwarz
Milind Pravin Shah
Ahmer Syed
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Design and Verification of Benzocyclobutene (BCB) Templates for Chip-to-Wafer Alignment in 3D Integration
2012
Dingyou Zhang
Jian-Qiang Lu
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Citations (2)
1