Old Web
English
Sign In
Acemap
>
authorDetail
>
R. Mohd Said
R. Mohd Said
Universiti Malaysia Perlis
Intermetallic
Microstructure
Soldering
Composite material
Materials science
5
Papers
65
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (5)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Microstructure evolution and phase formation of transient liquid phase Sn/Ag solder alloy via multiple reflow soldering method
2021
Norainiza Saud
K. F. Ng
R. Mohd Said
Show All
Source
Cite
Save
Citations (0)
Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste
2020
Journal of Materials Science: Materials in Electronics
R. Mohd Said
Mohd Arif Anuar Mohd Salleh
Norainiza Saud
Mohd Izrul Izwan Ramli
Hideyuki Yasuda
Kazuhiro Nogita
Show All
Source
Cite
Save
Citations (1)
Suppression of (Cu,Ni)6Sn5 Intermetallic Compound in Sn-0.7Cu-0.05Ni+1wt.TiO2 Solder Paste Composite Subjected to Isothermal Aging
2020
R. Mohd Said
Norainiza Saud
Maa Mohd Salleh
Mochd Nazree B. Derman
Show All
Source
Cite
Save
Citations (0)
The Effect of Ni and Bi Additions on the Solderability of Sn-0.7Cu Solder Coatings
2019
Journal of Electronic Materials
Mohd Izrul Izwan Ramli
Mohd Arif Anuar Mohd Salleh
Mohd Mustafa Al Bakri Abdullah
Pavithiran Narayanan
Jitrin Chaiprapa
R. Mohd Said
S Yoriya
Kazuhiro Nogita
Show All
Source
Cite
Save
Citations (25)
Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
2016
Microelectronics Reliability
Mohd Izrul Izwan Ramli
Norainiza Saud
Mohd Arif Anuar Mohd Salleh
Mohd Nazree Derman
R. Mohd Said
Show All
Source
Cite
Save
Citations (39)
1