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Yoshiki Sota

6

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80

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Three-dimensional very thin stacked packaging technology for SiP

2002 ECTC | Electronic Components and Technology Conference
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Development of highly reliable CSP

1997 ECTC | Electronic Components and Technology Conference
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CSP packaging and mounting technologies for mobile apparatus

1997
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Development of high reliability

1996
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Development of high density memory IC package by stacking IC chips

1995 ECTC | Electronic Components and Technology Conference
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Citations (2)