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나예은 ( Ye Eun Na )
나예은 ( Ye Eun Na )
Wafer
Anodic bonding
Q factor
Thin film
Microelectromechanical systems
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3중 접합 공정에 의한 MEMS 공진기의 웨이퍼레벨 진공 패키징
2020
양충모
김희연
박종철
나예은 ( Ye Eun Na )
김태현
노길선
심갑섭 ( Gap Seop Sim )
김기훈 ( Ki Hoon Kim )
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