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Young-Bae Jeong
Young-Bae Jeong
SK Hynix
Electromigration
Coating
Copper interconnect
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Optimization of align marks and overlay targets in VIA first dual damascene process
2003
Dae-Ung Shin
Young-Bae Jeong
Jeong Lyeol Park
Jae Sung Choi
Jeong Gun Lee
Dae-Hoon Lee
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