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Jian Yin
Jian Yin
Jiangsu Normal University
Engineering
Miniaturization
Ultrasonic sensor
Electronic packaging
Soldering
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13
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Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps
2017
Microelectronics Reliability
Fan Liu
Lei Su
Mengying Fan
Jian Yin
Zhenzhi He
Xiangning Lu
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Citations (13)
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