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Fumiyoshi Kawashiro
Fumiyoshi Kawashiro
Renesas Electronics
Materials science
Metallurgy
Spectroscopy
Scanning electron microscope
Intermetallic
5
Papers
39
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Investigation of Formation and Growth Behavior of Cu/Al Intermetallic Compounds during Isothermal Aging
2014
Transactions of The Japan Institute of Electronics Packaging
Omid Mokhtari
Min-Su Kim
Hiroshi Nishikawa
Fumiyoshi Kawashiro
Satoshi Itoh
Takehiko Maeda
Tetsuya Hirose
Takaki Eto
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Mechanical Shock Durability Studies of Sn–Ag–Cu–Ni BGA Solder Joints on Electroless Ni–P/Au Surface Finish
2009
Transactions of The Japan Institute of Electronics Packaging
Fumiyoshi Kawashiro
Hajime Yanase
Masato Ujiie
Takaki Etou
Hiroshi Okada
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Reliability studies of Sn-Ag-Cu BGA solder joints on Ni/Cu/Au surface finish for SMAFTI packaging technology
2008
ECTC | Electronic Components and Technology Conference
Fumiyoshi Kawashiro
Masato Ujiie
Koujirou Shibuya
Yoichiro Kurita
Koji Soejima
Masaya Kawano
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Citations (6)
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