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Nanotechnology
Copper interconnect
Physical vapor deposition
Copper
Metallurgy
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Negative-side waterproofing 86
2016
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Barrier and seed layers for damascene copper metallization
1998
Solid State Technology
Barry Chin
Peijun Ding
Bingxi Sun
Tony Chiang
Darryl Angelo
Imran Hashim
Zheng Xu
Sergio Edelstein
Fusen Chen
A. Materials
S. Clara
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