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Lei Nie
Lei Nie
Tsinghua University
Microstructure
Materials science
Intermetallic
Composite material
Electroplating
3
Papers
2
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0
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Fabrication of Zirconium Nitride Nanopowder with a High Specific Surface Area by Introducing Fructose as a Double-Function Additive
2021
Ceramics International
Shijiao Zhao
Jing Song
Xu Rui
Lei Nie
Ma Jingtao
Changsheng Deng
X.Q. Cheng
Xingyu Zhao
Shaochang Hao
Jianjun Li
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A Study of Intermetallic Compounds in Tin Bumps during Multi-Reflows
2006
ICEPT | International Conference on Electronic Packaging Technology
Lei Nie
Jian Cai
Xiao Peng
Nan Zhang
Shuidi Wang
Songliang Jia
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Tin bumping for wafer level lead-free packaging
2005
ICEPT | International Conference on Electronic Packaging Technology
Lei Nie
Jian Cai
Zhao Fang
Shuidi Wang
Songliang Jia
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Citations (2)
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