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Soojeoung Park
Soojeoung Park
Samsung
Materials science
Electronic engineering
Composite material
Electromagnetic compatibility
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2
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18
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Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management
2018
ECTC | Electronic Components and Technology Conference
Jisun Hong
Kyoung-sei Choi
Dan Oh
Soojeoung Park
Shuai Shao
Huayan Wang
Yuling Niu
Van Lai Pham
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Citations (17)
Fine-pitch, cost effective flip chip package development: TAB-BGA
2010
ECTC | Electronic Components and Technology Conference
Soojeoung Park
Sang-Gui Jo
Ji-Yong Park
Hyon-chol Kim
Kawngjin Bae
Chulwoo Kim
Kyoung-sei Choi
Sa Yoon Kang
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Citations (1)
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