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Cheng-Hsien Lu
Cheng-Hsien Lu
National Chiao Tung University
Composite material
Polymer
Polyimide
Adhesion
Adhesive
6
Papers
15
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Asymmetric Wafer-Level Polyimide and Cu/Sn Hybrid Bonding for 3-D Heterogeneous Integration
2019
IEEE Transactions on Electron Devices
Cheng-Hsien Lu
Shu-Yan Jhu
Chiao-Pei Chen
Bin-Ling Tsai
Kuan-Neng Chen
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Citations (8)
Adhesion and Material Properties Between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3-D Integration
2019
IEEE Transactions on Components, Packaging and Manufacturing Technology
Cheng-Hsien Lu
Yi-Tung Kho
Chiao-Pei Chen
Bin-Ling Tsai
Kuan-Neng Chen
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Citations (2)
Adhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer/Metal Hybrid Bonding
2019
IEEE Transactions on Components, Packaging and Manufacturing Technology
Cheng-Hsien Lu
Yi-Lun Yang
Chiao-Pei Chen
Bin-Ling Tsai
Kuan-Neng Chen
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Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-Level Hybrid Bonding in 3D Integration
2018
ECTC | Electronic Components and Technology Conference
Cheng-Hsien Lu
Yi-Tung Kho
Yu-Tao Yang
Yu-Pei Chen
Chiao-Pei Chen
Tsung-Tai Hung
Chiu-Feng Chen
Kuan-Neng Chen
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Polymer for wafer-level hybrid bonding and its adhesion to passivation layer in 3D integration
2017
ICEP | International Conference on Electronics Packaging
Cheng-Hsien Lu
Yi-Tung Kho
Chuan-An Cheng
Yen-Jun Huang
Kuan-Neng Chen
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Citations (2)
Effects of bonding technology and thinning process in three-dimensional integration on device characteristics.
2012
Journal of Nanoscience and Nanotechnology
Cheng-Hsien Lu
Chuan-An Cheng
Chia-Hua Ho
Kuan-Neng Chen
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Citations (1)
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