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Simon P. Cross
Simon P. Cross
Science and Technology Facilities Council
Optoelectronics
Materials science
Electrically conductive adhesive
Ball bonding
Flexible electronics
2
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9
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Characterization of the Uniformity of High-Flux CdZnTe Material.
2020
Sensors
Matthew C. Veale
Paul Booker
Simon P. Cross
M. Hart
Lydia Jowitt
J. Lipp
Andreas Schneider
Paul Seller
Rhian Mair Wheater
Matthew D. Wilson
C. C. T. Hansson
Krzysztof Iniewski
Pramodha Marthandam
G. Prekas
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Stencil Printing and Flip-Chip Bonding for Assembly of Pixelated X-ray Detectors using PCB-type Interposer and Flexible Printed Circuit Boards
2019
EMPC | European Microelectronics and Packaging Conference
Andreas Schneider
Simon P. Cross
Matthew D. Wilson
Matthew C. Veale
M. Hart
Paul Seller
Marcello Borri
Dan Beckett
J. Lipp
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Citations (1)
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