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Young-Ho Kim

IBM

6

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145

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Compositions pour pâtes pour traversées et son utilisation pour la fabrication de traversées conductrices dans des substrats céramiques de circuit

1992
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Pastenmischung für Durchgänge und Verwendung derselben zur Ausbildung von Durchgangsleitungen in keramischen Schaltungssubstraten

1992
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Summary Abstract: Polyimide–copper interfaces: Growth sequence dependence and solvent effects

1988 Journal of Vacuum Science and Technology
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Polyimide on copper: The role of solvent in the formation of copper precipitates

1988 Applied Physics Letters
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Adhesion and interface investigation of polyimide on metals

1988 Journal of Adhesion Science and Technology
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Citations (71)